TAIROS 2026 — Original Event AnnouncementTAIROS 2026 原始參展公告

Swancor Booth

Advanced Packaging & Next-Gen Power Module

RobiChip will present its high-power-density Power SoC platform direction with Swancor’s advanced materials and thermal-solution context, highlighting how packaging, thermal path, and system integration enable compact motion systems for robotics, UAVs, and intelligent machines.

羅比芯將結合上緯的先進材料與熱解決方案場景，呈現高功率密度 Power SoC 平台方向， 說明封裝、熱路徑與系統整合如何支援機器人、無人機與智慧機器中的小型化動力系統。

Maxon Booth

RobiThrust UAV Propulsion Validation

RobiChip will showcase RobiThrust as a UAV propulsion validation platform, connecting RobiDev, maxon motor, propeller, measurement, and thermal observation into a practical motor-driver matching workflow.

羅比芯將展示 RobiThrust 無人機推進驗證平台，串接 RobiDev、maxon motor、螺旋槳、 量測與熱觀察，形成實際可用的 motor-driver matching 驗證流程。

High-power-density Platform

高功率密度平台

Learn how RobiChip positions RobiSoC as a compact power platform for robotics, UAVs, actuators, and intelligent machines.

Thermal Path & Materials

熱路徑與材料

Discuss how advanced materials, package-to-structure heat flow, and system-level thermal thinking support compact motion modules.

UAV Propulsion Validation

無人機推進驗證

See how RobiThrust connects RobiDev, motor, propeller, measurement, and thermal observation for real propulsion evaluation.

From Pilot to Product

從 pilot 到產品導入

Discuss customer pilot projects, RobiDev evaluation, RobiLab validation, and future RobiSoC design-in opportunities.