RobiChip at TAIROS 2026|
RobiChip at TAIROS 2026|
Swancor Booth Hall-2 + Maxon Booth Hall-1
Swancor Booth Hall-2 + Maxon Booth Hall-1
RobiChip will present its high-power-density Power SoC platform direction through advanced packaging / thermal collaboration and UAV propulsion validation demos. 羅比芯將透過先進封裝 / 熱材料合作與無人機推進驗證展示,呈現高功率密度 Power SoC 平台方向。