PARTNERSHIP & ECOSYSTEM · 合作與生態系
Connect complementary engineering capabilities with a concrete pilot, measured evidence and a path to Design-in.串接互補工程能力，以具體 pilot、量測證據與設計導入路徑推進合作。
FOUR ECOSYSTEM TRACKS · 四種生態合作路徑
01
Robotics, UAVs, AMR / AGV, gimbals, actuators and industrial automation. Start with a motor-drive baseline, then extend to system validation.服務機器人、無人機、AMR／AGV、雲台、致動器與工業自動化；先建立馬達驅動評估基準，再擴展到系統驗證。
Explore applications · 查看應用 ↗02
MCU vendors, firmware teams and controller suppliers can co-develop control boards, interfaces and application-specific reference designs.MCU 廠商、韌體團隊與控制器供應商，共同開發控制板、介面與應用專屬參考設計。
M1 / M2 collaboration · 控制層合作 ↗03
OSAT, substrate, materials, cooling and reliability teams align package-to-system requirements, DFM and pilot readiness.封裝、基板、材料、冷卻與可靠度團隊，協同定義封裝至系統需求、DFM 與試產準備。
Explore integration scope · 查看整合範圍 ↗04
Universities, laboratories, research teams and developer communities use RobiDev for evaluation, teaching, firmware development and validation projects.大學、實驗室、研究團隊及開發者社群，透過 RobiDev 進行評估、教學、韌體開發與驗證計畫。
RobiDev Ecosystem · 開發生態 ↗RobiDev Discrete provides an early engineering baseline; RobiDev High-Density supports RobiSoC evaluation. A RobiThrust + RobiDev bundle extends the work to propulsion validation.RobiDev Discrete 建立前期工程基準；RobiDev High-Density 支援 RobiSoC 評估；RobiThrust＋RobiDev 組合則延伸至推進系統驗證。具體配置與供應依專案確認。
STRATEGIC CUSTOMER PROGRAM · 策略客戶合作
For customer-owned algorithms, firmware, protocols, sensing and protection logic, define a Custom RobiSoC or RobiSoC-based module through confidential feasibility review and co-development.涉及客戶自有演算法、韌體、通訊協定、感測與保護邏輯時，以保密可行性審查與共同開發，界定客製 RobiSoC 或模組。
Define the control intelligence and application behavior to integrate.界定需整合的控制技術、介面與應用行為。
Align MCU, power stage, voltage / current range, sensing, I/O, package and thermal path.對齊 MCU、功率級、電壓電流範圍、感測、I/O、封裝與熱路徑。
Use RobiDev, RobiLab and application fixtures to review engineering samples against agreed requirements.透過 RobiDev、RobiLab 與應用治具，依約定需求檢視工程樣品。
Progress through NRE development, engineering samples, pilot builds and qualification before production planning.依序完成 NRE 開發、工程樣品、pilot 與資格驗證，再規劃產品供應。
Customer background IP, RobiChip platform IP and joint improvements are identified separately. Ownership, licensing, field of use and publication terms are defined in the project agreement.客戶既有 IP、羅比芯平台 IP 與共同改良成果分別界定；所有權、授權、應用領域及公開條件依專案協議約定。
Feasibility review洽詢可行性評估PUBLIC COLLABORATION · 公開合作案例
Advanced materials, thermal solutions and RobiChip’s Power SoC / Hybrid Substrate platform meet in a shared system-validation direction for intelligent machines.結合先進材料、散熱解決方案與羅比芯 Power SoC／Hybrid Substrate 平台，共同推進智慧機器的系統驗證方向。
This case documents public collaboration. It does not by itself establish exclusivity, final qualification or a volume-production commitment.此案例記錄已公開合作；本身不代表排他條件、最終認證或量產承諾。
M1 / M2 · CONTROL-LAYER COLLABORATION
M1 uses an STM32G4x-series baseline for initial validation. M2 is a project-based control-layer option covering customer controllers, firmware, toolchains and application-specific I/O—including CANBus, RS-485, UART, SPI, PWM, encoder feedback and current sensing.M1 採用 STM32G4x-series 基準進行前期驗證；M2 則依專案整合客戶控制器、韌體、工具鏈與應用介面，例如 CANBus、RS-485、UART、SPI、PWM、編碼器回授與電流感測。
Power architecture, GaN module direction, hybrid substrate, thermal paths, RobiSoC roadmap and RobiDev / RobiLab validation.功率架構、GaN 模組方向、混合基板、熱路徑、RobiSoC 路線與評估驗證。
MCU, motor-control firmware, toolchains, communications, developer support and co-developed reference designs.MCU、馬達控制韌體、工具鏈、通訊、開發者支援與共同參考設計。
Start with one tangible pilot: a control-board feasibility review, education kit, actuator reference design or UAV / gimbal demonstration.以一項具體 pilot 起步：控制板可行性評估、教育套件、致動器參考設計，或 UAV／雲台展示。
PACKAGING & THERMAL · 封裝與熱工程
Substrate process rules, thermal interfaces, die attach, interconnect and layout.基板製程規則、熱介面、晶粒接合、互連與佈局。
Thermal / power cycling, mechanical stress, vibration, failure analysis and package-to-system validation.熱循環、功率循環、機械應力、振動、失效分析與封裝至系統驗證。
Sample lots, process windows, yield learning and qualification planning.樣品批次、製程窗口、良率學習與資格驗證規劃。
Cost, capacity and repeatable high-power-density packaging processes.成本、產能與可重複的高功率密度封裝流程。
PARTNERSHIP WORKFLOW · 合作流程
Roadmap exchange → technical alignment → pilot definition → joint validation → go-to-market. Each stage names the scope, owner, validation method, schedule and next decision.路線交流 → 技術對齊 → pilot 定義 → 共同驗證 → 市場合作。每階段明訂範圍、負責人、驗證方式、時程與下一個決策。
Public platform materials support the first discussion. Detailed datasheets, raw measurements, design files, samples and partner-specific DFM or joint-improvement work may require NDA and formal collaboration documents.公開平台資料支援初步討論；詳細規格、原始量測、設計檔案、樣品及夥伴專屬 DFM／共同改良工作，依 NDA 與正式合作文件提供。
