Application-led engineering
RobiChip begins with the machine: thrust, torque, motion, temperature and system constraints. The semiconductor and package architecture follow from evidence.
羅比芯從智慧機器本身出發:推力、扭矩、運動、溫度與系統限制;再以實證回饋半導體與封裝架構。
COMPANY · 公司
RobiChip connects silicon, motor control, packaging, thermal engineering and system evidence into one Design-in path.羅比芯將晶片、馬達控制、封裝、熱工程與系統實證串成一條 Design-in 路徑。
WHAT WE BUILD · 我們打造什麼
RobiChip begins with the machine: thrust, torque, motion, temperature and system constraints. The semiconductor and package architecture follow from evidence.
羅比芯從智慧機器本身出發:推力、扭矩、運動、溫度與系統限制;再以實證回饋半導體與封裝架構。
RobiSoC, RobiDev, RobiThrust, RobiTorque and RobiLab create distinct layers from evaluation to product-integration intent.
RobiSoC、RobiDev、RobiThrust、RobiTorque 與 RobiLab 建立從評估到產品整合意圖的不同層級。
TECHNOLOGY HERITAGE · 技術傳承
RobiChip carries forward LMC-originated work in motor control, power integration, intelligent sensing and system engineering. Detailed corporate and IP diligence materials are handled through controlled review.羅比芯承接源自 LMC 的馬達控制、功率整合、智慧感測與系統工程經驗;公司與 IP 盡職調查資料則透過受控流程提供。
PUBLIC PROGRESS · 公開進展
IC Design category merit recognition supporting RobiChip’s semiconductor innovation path.
News & events新聞與活動Selected to present the semiconductor-defined motion opportunity to CVC and investor audiences.
Post-show report查看展後報告START A DESIGN-IN CONVERSATION · 開始設計導入
Start with the system, constraint or validation question. RobiChip will help identify the useful scope before a case is opened.從系統、限制條件或驗證問題開始;案件啟動前,先界定最有效的合作範圍。