FAN COOLING
41.6°C有風扇冷卻
Observed under the displayed test configuration; not a universal thermal rating.
EVIDENCE · 實證
Engineering claims need context.工程主張，需要完整脈絡。
Review the operating point, method, thermal path and maturity boundary behind each result.檢視每項結果背後的工作點、方法、熱路徑與成熟度邊界。
PROPULSION · 推進
Measured on the bench.在台架上量測。
RobiThrust connects motor, controller, propeller and thermal behavior at a documented operating point.RobiThrust 在文件化工作點下，串聯馬達、控制器、螺旋槳與熱行為。
SELECTED BENCH OBSERVATIONS
Evidence before architecture lock.架構定版前，先建立證據。
11.17gf/W average
平均效率
平均效率
+6.3%vs. baseline
相較基準
相較基準
1.6 kgf@ 240 W
台架結果
台架結果
47°Cmeasured T1
T1 實測
T1 實測
Results shown are tied to their stated bench conditions. Request the relevant test context before comparison.所示結果皆綁定其台架條件；比較前請先取得相關測試脈絡。
RobiThrust探索推進平台SILICON TO HEAT PATH · 晶片至熱路徑
Thermal behavior is architectural.熱表現是架構問題。
The public multi-path principle combines a thermally coupled conduction route with a guided-fluid convection route. Patent status and final claim scope remain subject to prosecution.公開的 multi-path 原則結合熱耦合傳導路徑與導引流體對流路徑；專利狀態與最終權利範圍仍以審查程序為準。
NO FAN
87°C無風扇
Comparison observation under its stated configuration and measurement context.
FIELD VALIDATION
Swancor Inside材料導入實證
Physical exhibit connecting advanced material, package and high-power-density system conversations.
FIELD EVIDENCE · 公開場域
From exhibit to next decision.從展示走向下一個決策。
TAIROS 2026
Two partner booths connected materials, motion, joint torque and UAV propulsion validation.
TAIROS recap查看展後成果SEMICON Taiwan 2026
Semiconductor-defined motion presented through technical and investor-facing sessions.
SEMICON recap查看展後成果START A DESIGN-IN CONVERSATION · 開始設計導入
Use evidence to define the next engineering gate.用實證界定下一個工程關卡。
Start with the system, constraint or validation question. RobiChip will help identify the useful scope before a case is opened.從系統、限制條件或驗證問題開始；案件啟動前，先界定最有效的合作範圍。