Prototype up to 700 W原型最高 700 W
Output demonstrated under documented prototype test conditions.於文件化原型測試條件下展示的輸出。
PLATFORM · ENGINEERING SAMPLE
The compact power-intelligence core.緊湊的動力智慧核心。

RobiSoC connects motor control, three-phase power, sensing, protection, packaging and thermal design as one governed platform.RobiSoC 將馬達控制、三相功率、感測、保護、封裝與熱設計整合為受控平台。
Output demonstrated under documented prototype test conditions.於文件化原型測試條件下展示的輸出。
Architecture target pending engineering validation—not a production rating.尚待工程驗證的架構目標,並非量產額定值。
Treat package and heat extraction as part of the semiconductor conversation.將封裝與散熱視為半導體設計的一部分。
Architecture targets, prototype results and final qualification limits are stated separately.架構目標、原型結果與最終認證限制分別陳述。
START A DESIGN-IN CONVERSATION · 開始設計導入
Start with the system, constraint or validation question. RobiChip will help identify the useful scope before a case is opened.從系統、限制條件或驗證問題開始;案件啟動前,先界定最有效的合作範圍。